站内搜索
|
详细信息 Product Name: Diamond Dicing Blades Model NO.: 1A1R, 1A8 Trademark: BONDFLEX, SAILI, SUMENG Origin: Jiangsu China HS Code: 68042210 Product Description Diamond dicing blades for silicon wafer, ultra thin and precision, more rigidity, accuracy, prevent the operation from slant and vibrationResin or metal bond ultra-thin diamond and CBN cut-off wheels use various resin or metal powders as the bond which are with different features for different purpose.metal bond wheels has an excellent resistance to high temperatures and deterioration, and excellent heat dissipation. It also features the highest abrasive grain holding power of all grinding wheels and has a long life.The metal diamond wheel is mostly used for grinding glass, ceramics and other non-ferrous metals, and is also used for precision grinding utilizing its high conductivity.Nickel-bond Dicing BladesThe Nickel binder provides longer blade life and lower wear rate and together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as: PCB, Silicon and BGABlade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size)Diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness)Resin-bond Dicing BladesResin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and GlassResin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size)Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness).metal-bond (Sintered) Dicing BladesWith slower wear rate than Resin but faster than Nickel, metal-bond (Sintered) blades are best suited for retaining package shape and size in applications such as: BGA, Soft Alumina, TiC, LTCC and FerriteBlade thickness varies from 3 mil to 60 mil (depending on diamond grit size)Diamond grit size ranges from 2 microns to 70 microns (depending on blade thickness)
|